3D Integrated Circuits

Many 3D stacks will combine digital and analogy circuitry, requiring a robust analogue signal capability. For unique packaging requirements of stacked die, an IC/package co-design capability are requirement. Additionally, fitting 3D ICs on a board is challenging, requiring a capable PCB layout system with appropriate analysis tools.

Despite the benefits, the 3D-IC also brings forth new challenges:

1.Design Challenges: The dimension brings forth an additional control variable during the look of the electronic system. Conventional design tools are geared towards 2D technology. New EDA tools for 3D- ICs are necessary.

2.Thermal Issues: In 3D-ICs, since several layers of electronic components that dissipate power are stacked vertically, the flexibleness density are some things above 2D- ICs, resulting in potential thermal issues .additionally , the oxide layer’s thermal conductivity (which is between silicon layers) is small and would therefore decrease the transfer of warmth to the environment. This exacerbates the 3D-IC heat issues. New 3D-IC cooling solutions is additionally needed.

3.TSV Induced Overheads: 3D-ICs incorporate thousands of TSVs for interlayer communication moreover as delivery of power/ground. These TSVs are causing additional overhead space. thanks to the expansion mismatch between silicon and TSV filling material, TSVs also cause thermal-mechanical stress. The thermal stress causes potential reliability problems, like cracking, and also timing violations since transistor delay are influenced by thermal stress.

4.Cross talk between Layers: Coupling might occur between the most effective layer metal wires and thus the device on the active layer above it. Furthermore, in heterogeneous integration, the RF Signal might influence the logic and memory in other layers. Overall, 3D Integration might be a serious development which include major impact on the planning of future electronic systems