NXP collaborates with Foxconn on next generation vehicle platforms NXP Semiconductors has signed a memorandum of understanding (MoU) with Hon Hai Technology Group (“Foxconn”) to jointly develop platforms for a new generation of smart connected vehicles. Foxconn, the world’s largest electronics manufacturer, will leverage NXP’s portfolio of automotive technologies & its longstanding expertise in safety & security to enable architectural innovation & platforms for electrification, connectivity & safe automated driving.

Amid the semiconductor shortage, researchers are honing in on tin selenide as a low-energy means to compute, transmit, or store information using light One of the most widespread effects of the COVID-19 pandemic has been the ongoing global semiconductor chip shortage. Pandemic-induced supply chain disruptions coupled with surging demand have stymied OEMs and automotive manufacturers from procuring chips in the quantities needed.

Samsung began sampling new 16 Gbps GDDR6 DRAM featuring 24 Gb/s speed to power next-generation computing systems. Graphics double data rate 6 (GDDR6) DRAM (dynamic random access memory) is a high-speed synchronous memory technology specialized for applications requiring high bandwidth like graphics processing units (GPUs) and high-performance computing. Despite its primary use in graphics-driven applications, GDDR has recently found its way into automotive and networking applications.

Based on NXP’s ultra-wideband (UWB) technology & the payment expertise of ING, the pilot aims to make peer-to-peer payments more intuitive & seamless. What’s new: NXP® Semiconductors has announced that it is working with ING Bank N.V. on Project NEAR, ING’s pilot of the industry’s first UWB-based peer-to-peer payment application. The pilot programme will leverage UWB-enabled Samsung Galaxy smartphones to allow consumers to directly share money with peers through the ING banking application…

Where other wearables falter, e-tattoos are showing major promise, especially in the medical field regarding blood pressure monitoring. Wearable electronics is a subsect of consumer electronics that has grown by leaps and bounds in the past decade. …

Based on its patented 3D computing architecture, Oxford Quantum Circuits is developing a quantum computing-as-a-service (QCaaS) solution. Since quantum computing hardware is incredibly complex and requires a carefully-controlled, super-cooled environment to operate properly, it is not easily mass produced. …

Announced at WWDC, the new ‘hands-free’ proximity feature is making its way to a third-party chip manufacturer Image: apple.com Apple developers got a taste of iOS 16’s new Nearby Interactions feature at WWDC last month that lets third-party smart devices talk to Apple’s ultra-wideband (UWB) U1 chips in the background…

Synchron recently announced the human brain-computer interface (BCI) implant done on a human in the U.S. Considered by many to be a thing of science fiction, BCIs are quickly becoming a reality. …

Hoping to further the spread of 5G networks, a collaboration between Qualcomm, Ericsson, and Thales investigates 5G non-terrestrial networks (5G NTN). While a large percentage of the modernized world is beginning to reap the benefits of the 5G revolution, there is still a large percentage of the world that doesn’t…