What is Die Attach Tools?
There are various Die Attach Tools required for the Die Attach, which is alternatively known as Die bonding. Starting with the rubber tips, rubber holders, and pick up tools, to the adhesive, ejection and holding systems.
These tools are required for the highly precise process of attaching a semiconductor die or chip, to a substrate or package such as leadframe, die, or PCB board. Due to the complicated process required in wafer expansion and the various Die Attach methods, which includes Soft Solder Die Attach, Eutectic Die Attach, Epoxy Die Attach, UV Die Attach, Silver Sintering Die Attach, Thermocompression Die Bonding, and Flip Chip Die Attach.
Die Attach is an important process. Hence, the tools used for the process should be of top-notch quality. This is why Oricus Semicon Solutions uses top quality material to produce the Die Attach tools required for the process.
The Die Attach Tools family includes Rubber Tips, which is available in more than 300 standard designs that come with options for full customisation to your chip or package. It is also manufactured from in-house RoHS and REACH compliant material.
There are 5 main products for the rubber tips. There are the Flat Tips, Vacuum Relief Tips, Groove Tips, Matrix Tips, as well as Side Contact Tips.
These rubber tips are made from our rubber compounds that are geometric flexible with ESD Protection. It is entirely developed by our in-house Material Science Research and Development team, with the latest innovations in rubber technology. It features formulations that are designed especially for use in the semiconductor industry.
With Rubber Tips, comes the Rubber Holders, to hold the rubber tips, maximizing the performance of your process and equipment. Rubber holders are designed in various application-specific configurations and full turnkey solutions for Rubber Tips and holders.
There are also Pick Up Tools, made from Tungsten Carbide, for demanding applications, to the Engineering Plastics, for high volume products. Oricus Semicon Solutions also provide tools that are designed specifically for your application.
There are 3 types of systems available, namely the Ejection, Adhesive, and Holding systems. Starting with Ejection systems, there is 3 type of needles available. It comes in Standard, Twin and Quad designs, which are paired with our Needle holders and Pepper Pots, which offers optimal ejection performance, for your maximum productivity.
Next, the Adhesive systems come in 2 types of dispensers, the Single and Multi Tube dispensers. Along with the dispensers, there are Stamping tools, Flux Plates, Flux Scrapers and Spanker Tools to make up the line of tools for the Adhesive Systems we produce.
Last but not least, the Holding Systems, which consist of Anvil Blocks and Comb Clamps. It is designed to securely hold your Leadframe, substrates, leads of dam bars for complete Die Attach Solutions.
Being an innovative semiconductor tools manufacturing company with almost 100 years of collective expertise, Oricus Semicon Solutions strive to provide with the best tools for your Die Attach needs. To find out more about the Die Attach Tools that Oricus Semicon Solutions have, visit their website to find out more.