COB packaging technology application and advantages of LED small pitch screen

3 min readAug 16, 2023

In the field of LED display, with the continuous development of midstream packaging technology, SMD and COB have become the main LED display panel preparation technologies. SMD packaging is to package brackets, chips, leads, epoxy resin and other materials into display units with different pitches, while the COB display directly binds the LED chip to the PCB board with the drive circuit, and then uses the packaging glue to seal the LED chip. For encapsulation. This technology merges midstream packaging and downstream display applications. What is a fine-pitch LED display?

The following is the application and advantages of COB packaging technology in LED small-pitch screens:

1. Dense arrangement: COB packaging technology can realize high-density LED arrangement, and arrange multiple LED chips closely on a small-area substrate to achieve high-resolution and delicate display effects.

2. No module gap: COB packaging technology can reduce the module gap between LED pixels, making the gap between adjacent pixels smaller, thus presenting a smoother and coherent image visually.

3. Higher brightness and contrast: Due to the close arrangement of LED chips, COB packaging technology can achieve higher brightness and contrast, which can present vivid images in both indoor and outdoor environments.

4. Color consistency: COB packaging technology can package multiple LED chips on the same substrate, so as to achieve better color consistency and avoid color difference problems.

5. Good heat dissipation effect: COB packaging technology pastes the LED chip directly on the substrate, which can transfer heat more effectively, improve the heat dissipation effect, and help to extend the life of the LED display.

6. Compact structure: COB packaging technology can reduce the overall size of the LED display, making the display thinner and lighter, suitable for places with limited space.

COB technology realizes the conversion from “point” light source to “surface” light source, eliminating pixel graininess. In addition, it can effectively control the brightness of the center of the pixel, reduce light intensity radiation, suppress glare, moiré and stimulation to the retina, suitable for close-up and long-term viewing, and avoid visual fatigue. Monitoring, command center, etc., are the best solutions.

The COB technology adopts the way of overall packaging, which avoids the high temperature damage of the SMD display panel due to the different expansion coefficient of the material in the reflow soldering process. Normally, the failure rate of COB display products is only one-tenth of that of SMD display products, thus reducing after-sales maintenance costs. In addition, compared with the traditional SMD technology, COB technology mounts the LED chip on the PCB circuit board, and then covers and fixes it with optical resin to form a protective shell, which improves stability, reliability and adaptability. In the field of high pixel density LED display, COB technology has obvious advantages over SMD technology, and is expected to become the core technology of LED display applications in the future.

Thank you for watching. I hope we can solve your problems. Sostron is a professional LED display manufacturer. We provide all kinds of displays, display leasing and display solutions around the world. If you want to know: What supporting equipment is needed to play video on the LED screen? Please click read.

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COB packaging technology application and advantages of LED small pitch screen

Written by Chinaseoer