Designing Print Circuit Boards Assembly with Surface Mount Technology
We always headlong when it comes to technology, and at times the traditional technology seems like they will not phase out. But is it that simple? Through Hole and Surface Mount are the two types of technologies used by the printed circuit board assembly manufacturers to produce the components, where the latter being the latest. To solder on the other end, elements of through-hole provide leads that require to pass through the printed circuit board (PCB). Also, for all the through-hole components mounted on the board, the PCB fabricator is needed to drill holes as it limits the board density by not allowing it to go below a certain level.
On the other hand, Surface Mount Technology (SMT), does not use protruding leads but instead uses end caps that solder on to pads on the PCB surface. Printed Circuit Board Assembly manufacturers can reduce the physical size of SMT components, as they do not require leads for mounting. Thus it results in a smaller board and increases the packing density on the PCB Assembly.
With a direct placement on the printed circuit board surface, SMT replaces the through-hole mounting of PCB components through its design and fabrication process. Further, designers can realize uniformity in component sizes as the components and package of Surface Mount Technology are mostly standardized. Moreover, with an aim to simplify the development processes for industries utilizing and manufacturing SMT fabrication equipment, component manufacturers, and PCB designers, the Joint Electron Device Engineering Council or JEDEC specifies these standards.
Benefits with Surface Mount Assembly
Nowadays, to design and manufacture modern electronic equipment’s like Smartphones, television, computer boards, the home appliance such as refrigerators and laundry machines, SMT is utilized in the vast majority of printed circuit boards. Highly-technical design tools such as CAD software and specialized PCB development programs need to build PCB creating mass-produced with SMT construction. Consideration for manufacturing capabilities is integrated into the initial design as design engineers currently have software products at their disposal that interact with fabrication tools. Thus, this coupled process from design to fabrication refers to as design for manufacturing (DFM).
For manufacturing incorporating SMT assembly processes, approved design are often released. This technology not only provides many advantages for production but also for the company who designs the board for a product.
Automated fabrication processes
To provide high-quality PCBs, which utilize surface mount components consistently and reliably, Printed Circuit Board Assembly manufacturers can leverage efficient fabrication equipment.
Weight and Size
In today’s dwindling electronic devices this factor is essential. Moreover, lighter boards are produced through the attributes of smaller devices and the capability of installing SMT components on both sides of the board results in fewer or smaller boards to take less space in the end product.
Reduced cost
To affix components and devices to board materials, printed circuit board assembly manufacturer significantly reduces operation for hole drilling through surface mounting of components.
Therefore, due to the speed of manufacturing, cost reductions and call for miniaturization, SMT design and production has taken over the market for PCB providers. Moreover, for printed circuit board manufacturing advanced in the development of equipment can place components consistently at high speed, further escalating the popularity and use of SMT.
PCC that provides an electronic manufacturing services offers best PCB Assembly Services for low and medium volume, high mix products, to various customer markets globally. Their factory is fully equipped with state-of-the-art, well-maintained equipment for manufacturing both SMT (Surface Mount Technology) and TH (Through-Hole) technology PCB assemblies.