Die Attach Paste Market Opportunity and Forecast 2023–2030

Die Attach Paste Market Opportunity and Forecast 2023–2030

The Die Attach Paste Market is expected to grow from USD 699.90 Million in 2022 to USD 921.00 Million by 2030, at a CAGR of 4.00% during the forecast period.

What is Die Attach Paste?

Die Attach Paste is a type of material used in the semiconductor industry for attaching die/chips to packages/carriers.

Die Attach Paste Market Size

The global Die Attach Paste market research report has segmented the market based on type, application, region, and market players. The types of Die Attach Paste include No-Clean Pastes, Rosin Based Pastes, Water Soluble Pastes, and Others. The applications include SMT Assembly, Semiconductor Packaging, Automotive, Medical, and Others. The regions covered are North America, Asia Pacific, Middle East, Africa, Australia, and Europe. The market players include SMIC, Alpha Assembly Solutions, Shenmao Technology, Henkel, Shenzhen Weite New Material, Indium, Tongfang Tech, Heraeu, Sumitomo Bakelite, AIM, Tamura, Asahi Solder, Kyocera, Shanghai Jinji, NAMICS, Hitachi Chemical, Nordson EFD, Dow, Inkron, and Palomar Technologies. Regulatory and legal factors specific to the Die Attach Paste market conditions are also considered in the report.

Die Attach Paste Market Segment Analysis

The latest trends followed by the Die Attach Paste market include the use of nanotechnology, which has resulted in the development of high-performance adhesives that offer high thermal conductivity and reliability. Other trends include the increased use of conductive die attach pastes, which provide better reliability and thermal performance over non-conductive adhesives.

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