一些關於Nvidia下一代AI晶片R系列/R100的預測更新 / Some prediction updates about Nvidia’s next-generation AI chip R-series/R100
1 min readMay 7, 2024
- Nvidia下一代AI晶片R系列/R100 AI晶片將在4Q25量產，系統/機櫃方案預計將在1H26量產。
- R100將採台積電的N3製程 (vs. B100採用台積電的N4P) 與CoWoS-L封裝 (與B100相同)。
- R100採用約4x reticle設計 (vs. B100的3.3x reticle設計)。
- R100的Interposer尺寸尚未定案，有2–3種選擇。
- R100預計將搭配8顆HBM4。
- GR200的Grace CPU將採台積電的N3製程 (vs. GH200/GB200的CPU採用台積電N5)。
- Nvidia已理解到AI伺服器的耗能已成為CSP/Hyperscale採購與資料中心建置挑戰，故R系列的晶片與系統方案，除提升AI算力外，耗能改善亦為設計重點。
- Nvidia’s next-generation AI chip, the R-series/R100 AI chip, will enter mass production in 4Q25, and the system/rack solution will likely start mass production in 1H26.
- R100 will use TSMC’s N3 node (vs. TSMC’s N4P for B100) and CoWoS-L packaging (same as B100).
- R100 adopts about 4x reticle design (vs. B100’s 3.3x).
- The interposer size for R100 has yet to be finalized. There are 2–3 options.
- R100 will be equipped with eight HBM4 units.
- GR200’s Grace CPU will use TSMC’s N3 process (vs. TSMC’s N5 for GH200 & GB200’s Grace CPU).
- Nvidia realizes that the power consumption of AI servers has become a challenge for customers’ procurement and data center construction. Hence, the R-series chips and system solutions focus on improving power consumption in addition to enhancing AI computing power.
