台積電投資ARM與IMS之分析 / Analysis of TSMC’s investment in ARM and IMS

https://pr.tsmc.com/chinese/news/3064

我認為台積電這兩筆投資主要目的為提高垂直整合能力，以確保從目前3奈米的FinFET技術能順利轉換到2奈米的GAA技術。

Intel將用18A製程 (約等同台積電2nm製程) 生產ARM自家晶片，可能是台積電需更積極投資ARM的其中一個原因。台積電可藉由投資ARM並進行更緊密的合作 (如DTCO與STCO)，有助於在台積電的先進製程與封裝技術上針對ARM IP進行優化。

Apple與Nvidia最快有可能將在2026年用2nm技術分別生產iPhone處理器與B100的下世代AI晶片，因這兩大潛在2nm客戶也有投資ARM，故台積電投資ARM有利強化與Apple以及Nvidia的合作並爭取2nm訂單。

投資IMS則可確保關鍵設備的技術開發與供應能滿足2nm商用化的需求。

https://pr.tsmc.com/english/news/3064

I think TSMC’s two investments are mainly aimed at strengthening its vertical integration capabilities to ensure a smooth transition from the current 3nm FinFET technology to 2nm GAA technology.

Intel will use the 18A (roughly on par with TSMC’s 2nm node) to produce ARM’s own chips, which may be one of the reasons why TSMC needs to invest more actively in ARM. TSMC can invest in ARM and engage in closer cooperation (such as DTCO and STCO) to help optimize ARM IP on TSMC’s advanced node and packaging technologies.

Apple and Nvidia will likely use 2nm technology to produce iPhone processors and B100’s next-generation AI chips, respectively, as early as 2026. As these two potential 2nm clients also invest in ARM, TSMC’s investment in ARM will be beneficial to strengthening cooperation with Apple and Nvidia and securing 2nm orders.

Investing in IMS can ensure that the technology development and supply of key equipment meet the needs of 2nm commercialization.