華通新成長動能來自華為高階手機與Amazon AI伺服器 / Compeq’s new growth momentum coming from Huawei’s high-end smartphones and Amazon AI servers
1 min readSep 14, 2023
- 華為Mate 60 Pro採用12層anylayer HDI主板，因華通生產良率較佳，故出貨比重約50–60%，顯著高於第二供應商方正。
- Mate 60 Pro因需求優於預期故2H23出貨預估已調升20%至約600萬部。展望2024年，華為將推新款高階P系列與Mate系列，預估零組件採購量為3,000–4,000萬部。
- 預期華通是華為2024年新款高階P與Mate系列的最大主板供應商，來自華為高階手機的貢獻在2024年預估至少成長150–200% YoY。
- 華通預期將自2024年開始進入AI伺服器市場，並成為該公司長期成長動能。若驗證順利，Amazon/AWS將為華通2024年AI伺服器客戶的關鍵客戶之一。
- Huawei Mate 60 Pro adopts a 12L anylayer HDI mainboard. Thanks to Compeq’s better production yield, the shipment allocation is about 50–60%, significantly higher than the second supplier Founder.
- Mate 60 Pro’s 2H23 shipment forecast has been raised by 20% to approximately 6 million units due to better-than-expected demand. In 2024, Huawei will launch the new high-end P series and Mate series, with an estimated component purchase of 30–40 million units.
- Compeq is expected to be the largest mainboard supplier for Huawei’s new high-end P series and Mate series in 2024, and the contribution from Huawei’s high-end smartphones is estimated to grow by at least 150–200% YoY in 2024.
- Compeq will enter the AI server market starting in 2024, and the entrance become the company’s long-term growth driver. If the qualification goes smoothly, Amazon/AWS will be one of Compeq’s major AI server customers in 2024.
