Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity

Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP substrates for mobile devices, according to industry sources.

Originally published at https://www.digitimes.com on December 5, 2019.