TSMC to kick off 3nm process manufacturing in 2022

TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node in 2022, according to JK Wang, the firm’s senior vice president for fab operations.

Originally published at https://www.digitimes.com on December 6, 2019.