Investing in STEM, Demand for Chiplets, and AI Chip Design: The Synopsys September Blog Roundup
By: Editorial Team
We’re looking back on some of our top blogs of the month of September. As technology continues to evolve at a rapid cadence, engineering ingenuity is a valuable currency. In the era of Smart Everything, innovation is a crucial but uphill battle, and it’s becoming more imperative to address the talent gap and nurture the semiconductor workforce of the future.
Dive deeper for insights on the importance of high-performance computing (HPC), advancing AI hardware, collaborating with universities, and much more.
We sat down with Priyanka Joshi, an intern in the Synopsys Solutions Group, to discuss breaking the glass ceiling as a woman in tech. In September, Priyanka presented her paper, SpyGlass Netlist Level Check on Low-Power DDR Design, at the annual WISH conference hosted by the Global Semiconductor Alliance. This interview sheds light on Priyanka’s influences, her career trajectory, advice to other women engineers, and more.
2. Providing University Students with Real-World Chip Design Experience
Collaborative business/university relationships, where a business provides resources to a university, has a positive impact on nurturing the interests of students and aids in closing the talent gap in the tech industry. Patrick Haspel, global program director of academic partnerships and university programs, highlights key examples of university-company collaborations around the world that are making strides in fostering relationships with STEM students.
3. What’s Driving the Demand for Chiplets?
As technology evolves, its applications follow suit. For HPC use cases such as complex financial transactions, genome sequencing, and natural language processing, the demand for much more powerful processors that can handle the intense workloads is needed now more than ever before. Kenneth Larsen, product marketing director of the Digital Design Group, provides insight on the inherent balancing act of implementing both high performance and low-power consumption features into today’s chiplets.
4. Empowering Chip Innovation with Hyper-Convergent Chip Design Technologies
There are many benefits of utilizing a correlated, hyper-convergent design flow to accommodate increasingly complex chip designs. In this post, Mark Richards, senior staff product marketing manager, and Shekhar Kapoor, senior product marketing director in the Synopsys Digital Design Group, explore the ways in which designers can employ innovative platforms such as the Synopsys Fusion Design Platform™ to deliver unprecedented full-flow quality-of-results and time-to-results.
5. What Are Key ISO 26262 Functional Safety Challenges for Automotive Design and Verification Teams?
Automotive functional safety (FuSa) is defined by ISO 26262 as the “absence of unreasonable risk due to hazards caused by malfunctioning of electrical and electronic systems.” Marc Serughetti, senior director of product marketing and business development of Embedded Software Solutions for the Synopsys Verification Group, discusses four key challenges that verification engineers must overcome in order to find and avoid bugs in automotive applications.
To view full-length versions of these articles along with other solutions-based pieces, visit our From Silicon to Software Blog.
