Topologic raised JPY 700m for the development of topological materials
Topological materials have a completely different electronic band structure from existing materials, and exhibit phenomena not seen in conventional representative materials such as insulators, conductors (metals), and semiconductors. In 2016, three researchers were awarded the Nobel Prize in Physics for “theoretical discoveries of topological phase transitions and topological phases of matter”.
Topologic has raised 700 million yen through a third-party allocation of shares to SBI Investment, The University of Tokyo Edge Capital (UTEC), Yamato Enterprise Investment, Japan Science and Technology Agency (JST), IT Farm, JMTC Capital, and Plug and Play Japan. With this, the total funds raised have reached 830 million yen, with the objective of deploying the capital the following main use cases.
Development of MRAM prototype chip
Topologic has started developing a new memory “TL-RAMTM” using topological materials. The main purpose of this financing is to design, develop and demonstrate a prototype chip with a target of the end of 2025 as the next phase.
Along with demonstrating the usefulness and process suitability of devices using topological materials, Topologic will conduct a proof-of-concept (PoC) of the “TL-RAMTM” memory device using these devices, and aim to demonstrate performance surpassing that of conventional memory devices.
Compared to conventional products, “TL-RAMTM” is an MRAM (magnetic memory) with the following 3 strengths:
- 1/10 or less power consumption
- Write speed 100 times faster
- Higher integration through lower power consumption
In recent years, the rapid spread of AI such as ChatGPT has led to a global surge in power consumption due to the construction of large-scale data centers and associated facilities. According to estimates by the International Energy Agency (IEA), power consumption in 2026 is expected to increase up to 2.3 times that in 2022, indicating a further spike.
In this situation, Topo Logic aims to realize a sustainable low energy society where anyone in the world can live sustainably by drastically reducing total energy consumption based on memory through the practical application and spread of “TL-RAMTM”.
Application development of heat flux sensors
Topologic is currently conducting a PoC (technical verification) of the heat flux sensor “TL-SENSINGTM” through collaboration with a wide range of companies. Going forward, the company will complete demonstrations for killer applications with partner companies towards the commercialization of heat flux sensors, and aim to develop and launch concrete products and systems using heat flux sensors.
Compared to conventional products, “TL-SENSINGTM” is a heat flux sensor with the following 3 strengths:
- More than 100 times faster response
- Less than 1/1000 heat shielding with thin film structure
- Less than 1/100 manufacturing cost
It visualizes minute “heat” in less than 0.01 seconds and detects abnormal phenomena at high speed. Examples of use include abnormality detection and failure prediction of batteries and power semiconductors, thermal comfort control devices for body temperature and in-vehicle and indoor environments, chemical sensors combined with reaction catalysts and light absorbing films, gas sensors, etc., with potential for many applications.
Through the practical application and spread of “TL-SENSINGTM”, Topologic aims to solve the “heat” issues that have been overlooked at industrial sites up to now, and realize a society where electronic and semiconductor devices can be utilized more safely and conveniently.
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