7nm Mobile SoC and 5G Platform Technology
During the past decade, the world has witnessed rapid evolution of cellular communication technologies from 3G towards 5G. Qualcomm® Snapdragon SDM855 mobile SoC and world’s first commercial 5G platform using industry-leading 7nm FINFET technologies.
Mobile SoC chip integrated with CPU/GPU/DSP along with AI and advanced connectivity has become the main platform to drive CMOS technology advancement in recent years.
Snapdragon mobile SoC (SDM855) gets new octacore CPU, custom-designed GPU and DSP, AI engine reaching 7+ trillion operations per second, along with modem and WiFi for an integrated mobile solution, manufactured using leading-edge 7nm CMOS technology. The 7nm technology enables best-in-class chip area and performance in production.
The area scaling of 30~35% per generation is maintained from previous nodes used by flagship Snapdragon mobile SoCs. Speed/power is improved by +10%/-35% on a critical speed path design circuit.
SDM855 exhibits >30% CPU performance gain over the previous generation thanks to a new design architecture enabled by dual poly pitch process integration. Low voltage operation and tight spread in power consumption has been achieved through process and design co-development, delivering a high performance and low power solution for both mobile and AI applications. Extending the 7nm technology with 2nd-year process enhancement demonstrates up to 50mV CPU Vmin reduction without any change to design rules, which paves the road for an integrated 5G mobile platform with >10Gbps connectivity.
Overall CPU performance achieves >30% improvement for the same power when comparing to previous flagship Snapdragon SDM845 which was based on 10nm process. The chip power consumption spread has been improved by 60%
In addition to computational performance, low power consumption and long battery life are essential for small form-factor electronic devices to deliver feature-rich mobile applications to consumers.
Snapdragon mobile SoC SDM855 achieves> 30% CPU performance profit compared to the previous generation by empowering CPP64 core design based on 7nm technology node. > 100mV upgrades for low power performance achieved through collaborative design and development, and > 60% development on chip power consumption. Increased electrical compression strength. The hidden screen requirement is met with a change of design and work and perform well. The advanced 7nm process shows the same advantage of working as a second-generation technology specialist
which helps provide 40% mortality measurement while reaching the top 10 Gbps data rate for next generation 5G modems.
