Intech TechnolgiesEPOXY ENCAPSULATION SERVICESIntech Technologies is a leading provider of semiconductor assembly and packaging solutions, offering a wide range of advanced services to…Jan 9Jan 9
Intech TechnolgiesLID ASSEMBLY & PACKAGE SEALING SERVICESIntech Technologies is a trusted provider of semiconductor packaging solutions, offering a wide range of advanced services to meet the…Jan 9Jan 9
Intech TechnolgiesOPEN CAVITY/ AIR CAVITY PACKAGESWe specialize in the assembly of open cavity packages, ensuring the encapsulation of integrated circuits (ICs) for optimal performance and…Jan 9Jan 9
Intech TechnolgiesPLASTIC PACKAGESPlastic package manufacturing for mass volume production is a widely utilized method in the semiconductor industry. By employing lead…Jan 9Jan 9
Intech TechnolgiesReliability ServicesBall Shear Reliability Services — Assessing Package Integrity (JESD22-B116 | JESD22-B117)Jan 9Jan 9
Intech TechnolgiesESSENTIAL SEMICONDUCTOR PACKAGING TECHNOLOGIES THAT YOU NEED TO KNOWAll Silicon Integrated Circuits (Si) Need PackagingJan 9Jan 9
Intech TechnolgiesWHAT IS AU (GOLD) STUD BUMPINGStud bumping can be done using either Cu (Cupper) or Au (Gold). Here at Intech we have Au stud bumping capabilities. Stud bumping is rather…Jan 9Jan 9
Intech TechnolgiesFLIP CHIP TECHNOLOGY: ADVANCEMENTS IN PACKAGE ASSEMBLYFlip chip technology dates back to the early 1960’s. It was developed by IBM for their SLT modules used in IBM Systems. It was first…Jan 9Jan 9
Intech TechnolgiesAddressing R&D Challenges: Adapting Substrate Design for Large Die SizesAt Intech Technologies, we recently undertook a project that presented a unique set of challenges in our R&D packaging efforts. The task…Jan 8Jan 8
Intech TechnolgiesWafer-Level Packaging vs Flip-chipHow do electronic devices keep getting smaller and lighter? The word on the street is, that this is all happening due to “Fan-out Wafer…Jan 8Jan 8
