3D ICs

3D ICs Fabrication

3D IC Chip Fabrication

3D ICs with copper TSV and Cu/Ni/SnAg solder balls are fabricated in Global INTegration Initiative(GINTI). In fabricating process a temporary adhesive is spin-coated on carrier glass wafer. Then the wafer is bonded temporarily to another Silicon…

Three Dimensional Integrated Circuits (3D IC) Technology

Fabrication of Transistors in 3D IC Technology:

There are total six fabrication steps for the MOSFET :

3D-IC Technology and Reliability Challenges

Three-dimensional (3D) ICs using TSVs are the most promising candidate for high…

Reducing Test Time for 3D-ICs by Improved Utilization of Test Elevator.

A three-dimensional integrated circuit. As we know it is metal-oxide semiconductor. It is manufactured by stacking silicon. It is usually interconnecting them by using vertically. So, it is behaving like…

3D Integrated Circuits

Many 3D stacks will combine digital and analogy circuitry, requiring a robust analogue signal capability. For unique packaging requirements of stacked die, an IC/package co-design capability are requirement. Additionally, fitting 3D ICs on a board is challenging, requiring a capable PCB…

Fan-out Wafer Level Packaging of 3 Dimensional Integrated Circuits.

3D IC Technology

A 3D IC composed of two or more layers of active electronic components, integrated both horizontally and vertically.