From Chips to Chassis: The Role of Semiconductors in Modern Automotive Engineering — Part1
Welcome to our four-part series on the pivotal role of semiconductor technology in the automotive industry. This comprehensive exploration delves into how advanced semiconductor solutions are shaping the evolving demands of modern vehicles. Here’s an overview of what each part covers:
· Part 1: Introduction and Overview
Begin your journey with an in-depth look at the essential role of automotive nodes. This section compares automotive nodes to general-purpose nodes and discusses their key technical parameters, setting the foundation by emphasizing the specialized requirements of semiconductors in automotive applications.
· Part 2: Automotive Node Definition and Comparison
Delve into the specifics of what defines an automotive node, how it contrasts with general-purpose nodes, and the critical technical parameters that distinguish it. This part focuses on the unique challenges and standards that automotive semiconductors need to meet.
· Part 3: Automotive Chiplets, IP and Design Infrastructure
This part explores the extensive infrastructure surrounding automotive semiconductors, including intellectual property (IP) and design frameworks. It also covers the rigorous compliance and safety standards essential for automotive applications.
· Part 4: Future Trends and Strategic Importance
Conclude the series with a forward-looking perspective on the strategic importance of a resilient supply chain and the emerging trends in automotive semiconductors. This final installment reflects on how ongoing innovations and collaborations are poised to transform the automotive landscape.
Part 1
Introduction
Overview of Semiconductor Manufacturing in the Automotive Sector
In recent years, the automotive industry has experienced a profound shift, propelled mainly by the strides made in semiconductor technology. These semiconductors are the backbone of numerous automotive applications, from fundamental vehicle functions like power management and lighting systems to more intricate systems such as advanced driver-assistance systems (ADAS) and fully electric powertrains as vehicles incorporate more digital and autonomous features, the demand for highly reliable and robust semiconductor components has skyrocketed, underscoring the pivotal role of semiconductor technology in the automotive sector.
Designing and manufacturing semiconductors for automotive applications, known as ‘automotive nodes,’ differs markedly from those used in general consumer electronics. Given the safety-critical nature of many automotive functions, these automotive-specific nodes must meet higher standards of reliability and longevity.
The Critical Role of Automotive Nodes in Modern Vehicles and EVs
Automotive nodes are specialized semiconductor designs that cater to the unique needs of vehicle systems, particularly in terms of performance under harsh environmental conditions and stringent safety requirements. Integrating these nodes into modern vehicles supports a range of functionalities, from improving vehicle efficiency and safety to enabling the connectivity and intelligence needed for future mobility solutions.
Moreover, the shift towards electric vehicles (EVs) has further amplified the need for advanced semiconductor solutions. EVs rely heavily on semiconductor devices for battery management systems, power conversion, and the overall management of electric motors. These components must be energy efficient and capable of handling the high power and thermal stresses typical in EVs.
As the automotive industry continues to evolve towards more connected and autonomous vehicles, the role of semiconductor technology, particularly automotive nodes, becomes increasingly critical. This foundation sets the stage for understanding the complexities and innovations within the sector, as explored in the subsequent sections of this article
Growing Demand for Semiconductors in Modern Vehicles
Integration of Semiconductors in Vehicle Systems
The automotive industry’s shift towards more sophisticated electronic systems has significantly increased the demand for high-performance semiconductors. Modern vehicles are equipped with an array of sensors, controllers, and processors that manage everything from engine performance and energy efficiency to safety features and infotainment systems. As vehicles embrace more digital and autonomous technologies, the complexity and quantity of semiconductors required continue to rise.
Advanced driver-assistance systems (ADAS) rely heavily on semiconductors for automatic braking, adaptive cruise control, and lane-keeping assistance functions. These systems demand high-speed processing and robust data handling capabilities, pushing the limits of traditional automotive semiconductor technology.
Impact of Electric Vehicles on Semiconductor Demand
Electric vehicles (EVs) represent a significant catalyst for the expanded use of semiconductors in the automotive sector. EVs require complex electronic systems for battery management, power distribution, and motor control, which are fundamental to their operation and efficiency. The drive towards more connected and smarter EVs further escalates the need for advanced semiconductor solutions, encompassing everything from power electronics that handle high voltages to sophisticated energy storage and consumption systems.
Moreover, the move towards sustainable and energy-efficient transportation solutions underscores the necessity for innovations in semiconductor technology. Semiconductors are crucial in optimizing EVs’ energy efficiency, improving electric drivetrains’ performance, and enhancing the charging infrastructure.
Challenges and Opportunities
The burgeoning demand for automotive semiconductors presents unique challenges, including supply chain vulnerabilities and the need for continuous innovation to keep pace with technological advancements. However, these challenges also open opportunities for semiconductor manufacturers. Companies that can innovate and scale their operations to meet the automotive industry’s stringent requirements are poised to thrive in this expanding market segment, making the field of semiconductor manufacturing for automotive applications an exciting and dynamic space.
Furthermore, the importance of collaboration between automotive manufacturers and semiconductor companies cannot be overstated. This partnership is instrumental in developing tailored solutions that meet the evolving needs of modern vehicles. By working together, these entities can accelerate the development of new technologies and ensure that the automotive industry continues to advance in safety, efficiency, and connectivity. This collaborative approach fosters innovation and makes the audience feel part of a collective effort toward progress.
Standards and Compliance in Automotive Semiconductors
Automotive Grades and ASIL Compliance
In the automotive industry, ensuring the highest levels of safety and reliability is paramount. This is governed through various standards, with Automotive Safety Integrity Levels (ASIL) being central. ASIL, a risk classification scheme defined by ISO 26262, is part of the Functional Safety standards to ensure safety-critical systems perform to the requisite safety levels.
Automotive components are categorized from ASIL A (lowest) to ASIL D (highest) based on the hazard’s severity, exposure, and controllability. Semiconductor components used in automotive applications must often meet higher ASIL ratings, reflecting their critical role in vehicle safety systems such as steering and braking.
Automotive Safety Integrity Levels (ASIL) are fundamental to ISO 26262. They categorize the safety integrity requirements into four levels: ASIL A, B, C, and D. Each level is defined based on the severity, probability of exposure, and controllability of hazards, with ASIL D representing the highest safety integrity and ASIL A the lowest. These standards guide the development processes to ensure that automotive systems are free of unacceptable risks during failures.
ASIL Classification and Safety Risks:
· ASIL A: Low risk; minimal safety measures required.
· ASIL B & C: Moderate to high risk; stringent safety measures and redundancy must be implemented.
· ASIL D: Extremely high risk; demands the most stringent safety measures and multiple layers of redundancy.
o The risk levels are critical differences between ASIL-A (Automotive Safety Integrity Level A) and ASIL-D compliance requirements per the ISO 26262 standard. ASIL-D represents the highest level of risk, where a failure could potentially lead to life-threatening or fatal injuries. ASIL-A represents a low-risk level, where a failure is unlikely to lead to injuries.
o Design and Verification Processes: Compared to ASIL-A, which has less stringent design and verification requirements, ASIL-D requires highly robust design and rigorous verification processes to avoid systematic faults and ensure functional safety.
o Random Hardware Fault Detection: While ASIL-A may only require basic fault detection mechanisms, ASIL-D mandates more comprehensive detection and mitigation of random hardware faults through techniques like lockstep CPU cores, error-correcting codes (ECC), and built-in self-tests (BIST).
o Safety Mechanisms: ASIL-D often necessitates redundant safety mechanisms, such as diverse redundant execution paths, watchdog timers, and safe state handlers. ASIL-A typically does not require such extensive safety mechanisms.
o Quantitative Metrics: ASIL-D has more stringent quantitative targets for hardware metrics like the Single-Point Fault Metric (SPFM), the Latent Fault Metric (LFM), and the Probabilistic Metric for random Hardware Failures (PMHF), while ASIL-A allows for more relaxed targets.
o Documentation and Traceability: ASIL-D requires highly detailed documentation, rigorous requirements tracing, extensive safety analysis and testing artifacts.
o ASIL-A has less stringent documentation and traceability requirements.
The distinction between these levels dictates the rigor of the development processes and the complexity of the safety mechanisms required for automotive systems.
Comparison of Compliance Standards: AEC-Q100 vs. Automotive Grades
AEC-Q100 is a failure mechanism-based stress test qualification for integrated circuits, commonly used alongside ASIL and automotive grades in the automotive industry. While ASIL focuses on the safety integrity level required based on risk assessment, AEC-Q100 targets the reliability of the electronic components through rigorous testing under extreme conditions. Understanding the nuances between these standards is crucial for manufacturers to ensure safety and reliability in automotive components.
The three most AEC-Q standards often referred to are:
· AEC-Q100: Failure Mechanism Based Stress Test Qualification for Integrated Circuits
· AEC-Q101: Failure Mechanism Based Stress Test Qualification for Discrete Semiconductors
· AEC-Q200: Stress Test Qualification for Passive Components
The IEEE-SA P2020, a working group for automotive imaging standards, would also be worth mentioning. The working group is focused on developing meaningful key performance indicators (KPIs) that can quantify and describe the performance and limits of camera systems used in various applications.
Automotive Grades: Define the maximum operating temperature ranges in which automotive ICs must reliably operate. Higher grades allow operation in harsher under-hood environments closer to the engine.
Qualification involves stringent testing for parameters like electromigration, thermal stresses, ESD, latch-up, etc.
· Automotive Grade 0: -40°C to 150°C
· Automotive Grade 1: -40°C to 125°C
· Automotive Grade 2: -40°C to 105°C
· Automotive Grade 3: -40°C to 85°C
In summary, while ASIL is a functional safety standard for automotive electronics design, Automotive Grades specify the environmental ruggedness and temperature qualifications that the semiconductor process and packaging must meet, independent of the end application’s safety requirements. An automotive IC can be certified to one of the ASIL levels (E.g., ASIL-B) compliant for functional safety but must also meet a specific Automotive Grade level (e.g., Grade 1) to operate reliably in the target temperature range of the intended application.
EVITA and Security Aspects
With vehicle’s increasing connectivity, security becomes a critical concern. The E-safety Vehicle Intrusion Protected Applications (EVITA) project focuses on enhancing automotive security. It outlines standards and technologies for securing onboard networks and safeguarding data communication between vehicles and external networks.
Semiconductors in automotive applications must adhere to these security protocols to protect against unauthorized access and cyber threats, which are increasingly relevant as vehicles become more connected and autonomous.
Up Next in Part 2: “Automotive Node Definition and Comparison”
Dive deeper as we explore the technical backbone of the automotive semiconductor industry in Part 2. We’ll define what constitutes an automotive node and distinguish it from general-purpose nodes. This section will detail the unique specifications, standards, and technical parameters that make automotive nodes essential for modern vehicle systems. Gain a comprehensive understanding of how these specialized semiconductors meet the rigorous demands of automotive applications and pave the way for advancements in vehicle safety and efficiency.
References:
- Foundries Accelerate Auto Efforts — Semiconductor Engineering
- Foundry perspective on the automotive semiconductors market
- What does automotive qualification mean? (microcontrollertips.com)
- Energy Consumption of In-Vehicle Communication in Electric Vehicles
- ISO 26262 ASIL: How it is Determined for Automotive Applications
- What is ASIL (Automotive Safety Integrity Level)? — Synopsys
- Functional-safety analysis of ASIL decomposition for redundant automotive systems
- Safety + Security for Automotive SoCs with ASIL B Compliant
- Automotive Safety Compliance — Cadence
- ISO 26262 SOFTWARE COMPLIANCE IN THE AUTOMOTIVE
- A Guide to Automotive Safety Integrity Levels (ASIL)
- ISO 26262 ASIL: How it is Determined for Automotive Applications
- Challenges For Achieving Automotive Grade 1/0 Reliability In FCBGA And FcCSP Packages
- Understanding AEC-Q200: A Comprehensive Guide to Automotive