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All Stories published by Buffondt on June 25, 2019
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Buffon Digital & Technology
in
Buffondt
Jun 24, 2019
2019年1–3月(Q1)「半導體封裝及測試業」銷售概況
2019年1–3月(Q1)「構裝IC」(千個)整體銷售量為16,301,080，「IC/晶圓測試」(千元)銷售金額合計21,108,501。而在20…
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Buffon Digital & Technology
in
Buffondt
Jun 24, 2019
2019年1–3月Q1「積體電路」銷售概況
2019年1–3月Q1「積體電路」中「晶圓代工」項目合計5,590(千片)，「12吋及以上」晶圓銷售的2,170最高，「8吋」為2,573，「6吋及以下」銷售量合…
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June 24, 2019
June 26, 2019
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